Help Chips Beat the Heat
Our Mission
We unlock future computing power for chips by making them more thermally conductive.
Our sustainable, novel inorganic fillers for next-generation chip packaging offer 20 times higher thermal conductivity, along with improved protection performance. They cool the chips faster and reduce the operational surface temperature.
About
Challenging Heat Management
Currently hundreds of layers of transistors are being stacked on a single chip for higher computing power. This produces a lot of heat, and the poor heat management of the outdated packaging of these transistors has not changed in over 60 years. The latest Nvidia GPU has 208 billion transistors on a cracker-sized chip platform. It has seen a 60% maximum heat increase within only 1 year, and this is only going to get worse.
Our Technology
Leverage Existing Industry Technique with AI Modeling and Additive Processing
HEXAspec produces high-performance packaging fillers with controllable quality and shapes at a low cost.
Molding Compound and Fillers
Our Product
Ceramic Heat-Sinks
Ceramic Thermal Paste
Core team
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Tianshu (Sean) Zhai, Ph.D. Candidate
Chief Executive Officer & Co-founder
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Jing Zhang, Ph.D.
Chief Technology Officer & Co-founder
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Chen-Yang Lin, Ph.D. Candidate
Chief Product Officer & Co-founder
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