HEXAspec Newsletter August 2024

HEXAspec August 2024

Fundraising: April, 2025 (Pre-seed Round) Team Member: 4

Date Founded: May, 2024

This Month at HEXAspec

Welcome to HEXAspec's August Newsletter!

This summer, HEXAspec is on fire, rapidly advancing our prototyping design and industrial-grade thermal conductivity testing.

Hello HEXAspec Community,

Welcome to August! Just like the scorching Houston weather, HEXAspec is blazing ahead with our research progress. We’re excited to announce that we’re wrapping up the “Gen 0” prototype of our advanced chip packaging. Meanwhile, our team is diligently working on funding applications to support our next steps

HEXAspec is on a mission to revolutionize heat management in semiconductor chips, enhancing their thermal conductivity for cooler operation and reduced energy costs.

About Us:

Who We Are and What Drives Us Forward

HEXAspec was founded by three passionate materials science enthusiasts: an "entrepreneur guy," an “industry guy," and a "chips guy." These “nerdy owls” are avid AI users and advocates, excited yet concerned about its energy demands. Committed to making a difference, they aim to ensure AI's responsible advancement, creating a future where AI thrives without compromising our planet’s sustainability.

HEXAspec unlocks future computing power by enhancing semiconductor chips' thermal conductivity. We provide innovative inorganic fillers and molding compounds for next-gen chip packaging, enhancing chip protection, lowering cooling costs, and promoting sustainable practices. Read more

TLDR:

Quick Bites: The Essentials

HEXAspec is wrapping up “Gen 0” prototype for advanced chips packaging.

HEXAspec is awarded One Small Step Grant $100k to accelerate translational research.

More on Semiconductors: Intel’s Disastrous Week.

Asks:

Your Support Needed: Full Launch by Q3 2025

Potential Customers and Early Adopters: We are actively seeking industry partners with chip packaging capabilities who are looking for enhanced thermal performance and mechanical protection. Contact us to participate in our pilot tests! Data sheet of our Gen 0 Prototype will be released by Oct 2024. Keep in touch with us.

Interested in Our Full Pitch Deck? We are currently in discussions with investors, venture capitalists, and angel investors for our upcoming pre-seed funding round. Please contact us for more details and to receive our comprehensive pitch deck.

Take a closer look at the HEXAspec Prototype Gen 0.

We're staying on track with our chip packaging prototyping. Prototype Gen 0 is here, and while we fine-tune the processes, the datasheet covering thermal, mechanical, and electrical performance will be available next month. Meanwhile, we're excited to announce the setup of our prototype demonstration room in the Ion District. For more details or to schedule a visit, please contact us.

Picture description: HEXAspec chips packaging Gen 0 (L) vs Conventional chips packaging (R).

HEXAspec awarded $100K “One Small Step Grant”!

The Office of Innovation at Rice University recently announced the awardees of the second round of "One Small Step" Grants, aimed at accelerating the transition of Rice-developed technologies from lab to market. HEXAspec was selected as a standout applicant and awarded a $100K equity-free grant to support our translational research efforts. A detailed announcement will be released in the near future.

Intel’s disastrous week.

Intel is set to lay off 15% of its staff following a significant decline in revenue and billions in losses within its chip foundry business. A decade of underinvestment has left Intel with a substantial technology gap. The company missed the mobile chip boom following the iPhone’s launch in 2007 and has remained largely on the sidelines of the AI surge, while major companies like Meta, Microsoft, and Google are securing large quantities of Nvidia chips. Read more

Picture source: https://www.youtube.com/watch?app=desktop&v=YNUV-zL49oM

Recent Momentum:

We have gained some itty-bitty tractions over the past few months

HEXAspec won 1st place in the annual H. Albert Napier Rice Launch Challenge 2024, receiving a $50,000 prize. Read more

HEXAspec secured 1st place in the Rice Business Plan Competition 2024 Qualifier and represented Rice University as the sole team competing against startups from 42 universities from across the globe. Read more

Rice Engineering featured HEXAspec: Rice graduate students help chips beat the heat with advanced nanomaterials. Read more