HEXAspec was founded by three passionate materials science enthusiasts: an "entrepreneur guy," an “industry guy," and a "chips guy." These “nerdy owls” are avid AI users and advocates, excited yet concerned about its energy demands. Committed to making a difference, they aim to ensure AI's responsible advancement, creating a future where AI thrives without compromising our planet’s sustainability.

HEXAspec unlocks future computing power by enhancing semiconductor chips' thermal conductivity. We provide innovative inorganic fillers and molding compounds for next-gen chip packaging, enhancing chip protection, lowering cooling costs, and promoting sustainable practices. Read more

Potential Customers and Early Adopters: We are actively seeking industry partners with chip packaging capabilities who are looking for enhanced thermal performance and mechanical protection. Contact us to participate in our pilot tests!

Seeking Legal Counsel: We are actively looking for legal firms experienced in the semiconductor industry, early-stage deep tech startups, patent transfers, and international founders. Please contact us for further discussions.

Interested in Our Full Pitch Deck? We are currently in discussions with investors, venture capitalists, and angel investors for our upcoming pre-seed funding round. Please contact us for more details and to receive our comprehensive pitch deck.

(a) We are initiating our pilot test with our collaborators at EMD Electronics on our thermal conductive electronics coating.

(b) By the end of this summer, we aim to develop an industrial-grade prototype for chip packaging. We will evaluate its performance using standard industrial tests and initiate discussions with major design houses.

(c) Currently, we are working on the legal tech transfer and licensing process with Rice University in preparation for our upcoming fundraising efforts. Additionally, we have completed several applications for non-dilutive government funding to support early-stage hiring and improvements to our lab space.