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HEXAspec was founded by three passionate materials science enthusiasts: an "entrepreneur guy," an “industry guy," and a "chips guy." These “nerdy owls” are avid AI users and advocates, excited yet concerned about its energy demands. Committed to making a difference, they aim to ensure AI's responsible advancement, creating a future where AI thrives without compromising our planet’s sustainability. HEXAspec unlocks future computing power by enhancing semiconductor chips' thermal conductivity. We provide innovative inorganic fillers and molding compounds for next-gen chip packaging, enhancing chip protection, lowering cooling costs, and promoting sustainable practices. Read more
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